Soldering
Professional and Reliable Electronic Manufacturing Solutions
Product Overview
Equipped with multiple fully automated SMT production lines capable of mounting various package types, from 0201 to large BGA and QFN. Includes SPI, AOI, and X-Ray inspection systems to ensure soldering quality.
Minimum component: 0201
Maximum PCB Size: 500mm × 400mm
SMT Placement Accuracy: ±0.03mm
Daily output: 80K points
Supports fine-pitch packages such as BGA, QFN, and CSP
Core Advantages
High Yield Assurance
First-article inspection + process monitoring + final inspection for over 99.5% yield
Automated Production Line
Integrated fully automatic panel loader, printer, pick-and-place machine, and reflow oven
Precision Inspection
SPI Solder Paste Inspection, AOI Automated Optical Inspection, X-Ray Inspection
Technical Specifications
| Minimum component size | 0201 (0.6mm × 0.3mm)) |
| Maximum PCB Size | 500mm × 400mm |
| SMT placement accuracy | ±0.03mm (@3σ) |
| Mounting Speed | Up to 3800 points/hour |
| IC pin pitch | Minimum 0.3mm |
| BGA Package | Supports 0.4mm pitch and below |
| Stencil Material | Stainless Steel, Electroformed Nickel |
Application Areas
smartphone
Tablet
IoT devices
Wearables
Security Products
Need a quote?
Tell us your specific needs, and we'll create a custom solution for you.